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赵文生

博士 教授 | 博士生导师 学科:电子科学与技术 职务:电子学院副院长

毕业院校:浙江大学

研究方向:

电话: 邮箱:wshzhao@hdu.edu.cn

地址:下沙校区4教中106

手机访问

赵文生,电子信息学院(集成电路科学与工程学院)教授/博导/副院长,国家优青/浙江省杰青基金获得者、浙江省青拔。


教育与工作经历

2004.9-2008.6,哈尔滨工业大学,本科生

2008.9-2013.7,浙江大学,研究生

(2010.12-2011.6、2012.5-2013.2,新加坡国立大学,交流,期间于A*STAR IME实习4个月)

2013.8-2015.12,bob电竞ios ,电子信息学院,讲师

2016.1-2019.12,bob电竞ios ,电子信息学院,副教授

(2017.9-2018.9,美国佐治亚理工学院,访问学者)

2020.1-至今,bob电竞ios ,电子信息学院(集成电路科学与工程学院),教授、博导、副院长


科研工作:

面向三维集成电路与微系统仿真设计需求,开展无源器件建模、信号完整性分析、多物理场仿真等方面的研究,为EDA工具国产化替代提供技术支撑。此外,开展了微波传感、频选表面、共模噪声抑制滤波等方面的研究。

出版学术专著3部、章节5篇,发表SCI论文170余篇(含IEEE期刊论文100余篇),获授权发明专利60余项、软件著作权10余项。主持国家自然科学基金青年/面上/优青/重点、国家重点研发计划国际合作、浙江省杰青基金等项目,入选浙江省青拔、151工程、高校领军人才等计划,获中国电子学会优秀科技工作者、IEEE ICET 2022青年科学家等荣誉称号。

现为IEEE、中国电子学会高级会员,中国电子学会青年科学家俱乐部会员、中国电子学会半导体与集成分会/微波分会委员、中国电子学会电磁频谱专家工作组成员、中国仿真学会集成微系统建模与仿真专业委员会委员,担任IEEE Access、Microelectronics Journal、Chinese Journal of Electronics、Electromagnetics Science、微波学报等期刊编委。


育人工作:

连续3年在bob电竞ios “导师指导能力量化测评”中排名全校第一;

“邱均平颜金莲研究生教育奖励基金”首届杰出导师奖(最年轻纪录);

指导研究生连续6年入选浙江省专业学位研究生优秀实践成果;

指导研究生获得中国电子学会优秀硕士学位论文(近5年全校唯一);

指导研究生获得2024年EDA精英挑战赛赛题六、七(共10道赛题)第一名(全国唯一)。

研究生毕业后前往华为海思、华大九天、卓胜微、新凯来等企业就职,或前往香港城市大学、东南大学、电子科技大学等高校攻读博士学位。

指导多名本科生在IEEE Transactions/Journal等权威期刊发表论文,或以第一作者获授权发明专利,多名本科生前往西湖大学、南方科技大学、西安电子科技大学深造,或于本校攻读博士学位。


人才引进欢迎EDA、计算电磁学、多场仿真、信号完整性、微波器件、电路系统等领域的优秀博士来信咨询。

师资博后年薪45万元起,开展学术研究,支持申报国家自然科学基金、博后基金等项目、争取留校任教。


招生意向:团队每年录取博士研究生2~3名、硕士研究生10余名,欢迎邮件咨询,请附简历、本科成绩单及相关材料。

250531 对考生的期望.pdf

250531 课题组成员.pdf

背景:传统集成电路主要依赖晶体管尺寸缩小提升密度,从而提升算力。随着器件特征尺寸接近物理极限,量子涨落与统计效应难以避免,摩尔定律或将终结。

三维集成通过实现芯片竖直堆叠,结合硅通孔(Through-Si-Via, TSV)、重布线层(Re-Distribution Layer, RDL)等技术实现电学连接,从而提升集成密度,使系统体积更小、速度更快、功耗更低、性能更强。

三维集成在微纳工艺与系统集成间搭起跨尺度桥梁,可支持将不同半导体材料、不同工艺等有机结合,最大化利用现有成熟技术,提升良率、设计灵活性和产品附加值。最为重要的是,这一技术不依赖先进制程,与应用强相关,这在我国光刻机等先进设备被封锁情形下尤为重要。

近年来,国内研发机构、半导体公司等高度重视三维集成技术,在可预见的未来,三维集成电路与微系统将是功耗、性能、周期和成本综合平衡下的最优方案


研究方向:团队聚焦三维集成电路与微系统设计方法学及EDA工具研发,涉及信号完整性(Signal Integrity, SI)分析、多物理场耦合仿真、热管理等,未来进一步探索信号-电源-热完整性与电磁兼容协同设计方法,以及多物理场/可靠性轻量化模型构建方法,为三维集成电路与微系统敏捷设计提供技术支撑。

1、信号完整性分析与设计

广义上讲,信号完整性是指高速电路中互连线引起的所有问题,主要研究互连线与数字信号的电压、电流波形相互作用时,其电气特性如何影响产品性能。

1)互连线建模:针对TSV等互连构建宽带模型,成果集成至华大九天等软件平台,为EDA软件国产化奠定了基础。

2)分析与优化:结合AI算法实现信号眼图快速生成与故障识别,设计均衡器、共模噪声抑制滤波器等提升信号传输质量。

2、多场仿真及热完整性设计

芯片工作过程中产生大量焦耳热,温升影响材料特性,反过来影响电学性能并带来应力应变等问题。为提升芯片分析精度,需开展多物理场仿真分析,并探索高效热管理方法。

1)多物理仿真:基于有限元、谱元法等算法求解本构方程,实现电(磁)-热-力等多物理场耦合分析并开发求解器,进一步探索轻量化多场仿真数字孪生体模型。

2)热完整性设计:针对三维集成散热路径长等问题,探索微流通道、热电偶等新型热管理技术,提升散热效能,结合AI算法探索热完整性设计方法。

3、微波传感器与系统设计

1)微波传感:应用微波谐振机理设计高Q值谐振单元结构,结合AI算法提升设计效能,搭建微波介质/微流传感检测系统。

2)生物传感器:设计片上谐振单元,构建细胞多通道实时无损检测的生物传感微系统,实现肿瘤细胞早期筛查。



三维集成微系统示意图


科研项目

  • 国家自然科学基金联合基金重点支持项目(U24A20296)

  • 国家重点研发计划“政府间国际科技创新合作”重点专项(2025YFE0102500

  • 国家自然科学基金优秀青年科学基金项目(62222401)

  • 国家自然科学基金面上项目(61874038)

  • 国家自然科学基金青年项目(61504033)

  • 浙江省杰出青年基金(LXR22F040001)

  • 之江-燧原创新研究中心开放课题(2022MG0AB04)

  • 毫米波全国重点实验室开放课题(K201910、K202421)


此外,与华大九天、比昂芯、概伦电子、中国电科研究所等企业或科研单位合作开展技术攻关,承担多个横向课题。

纵向科研
横向科研
论文

Wen-Sheng Zhao, Xiao-Peng Wang, and Wen-Yan Yin, Electrothermal effects in high density through-silicon via (TSV) array, Progress In Electromagnetics Research, vol. 115, pp. 223-242, 2011

Wen-Sheng Zhao, Wen-Yan Yin, Xiao-Peng Wang, and Xiao-Long Xu, Frequency- and temperature-dependent modeling of coaxial through-silicon vias for 3-D ICs, IEEE Transactions on Electron Devices, vol. 58, no. 10, pp. 3358-3368, October 2011

Jiang-Peng Cui, Wen-Sheng Zhao, Wen-Yan Yin, and Jun Hu, Signal transmission analysis of multilayer graphene nano-ribbon (MLGNR) interconnects, IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 1, pp. 126-132, February 2012

Wen-Sheng Zhao, Wen-Yan Yin, and Yong-Xin Guo, Electromagnetic compatibility-oriented study on through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) arrays, IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 1, pp. 149-157, February 2012

Lin-Juan Huang, Wen-Sheng Zhao, Thermo-mechanical analysis of an improved thermal through silicon via (TTSV) structure, Progress In Electromagnetics Research M, vol. 30, pp. 51-66, 2013

Xu-Chen Wang, Wen-Sheng Zhao, Jun Hu, Tian Zhang, A novel tunable antenna using graphene-based artificial magnetic conductor (AMC), Progress In Electromagnetics Research Letters, vol. 41, pp. 29-38, 2013

Wen-Sheng Zhao, Lingling Sun, Wen-Yan Yin, and Yong-Xin Guo, Electrothermal modelling and characterisation of submicron through-silicon carbon nanotube bundle vias for three-dimensional ICs, Micro & Nano Letters, vol. 9, no. 2, pp. 123-126, February 2014

王高峰,赵文生,三维集成电路中的关键技术问题综述,bob电竞ios 学报,34(2): 1-7, 2014年3月

R. Zhang, W.S. Zhao, and W.Y. Yin, Investigation on thermo-mechanical responses in high power multi-finger AlGaN/GaN HEMTs, Microelectronics Reliability, vol. 54, no. 3, pp. 575-581, March 2014

Yun-Fan Liu, Wen-Sheng Zhao*, Zheng Yong, Yuan Fang, and Wen-Yan Yin*, Electrical modeling of three-dimensional carbon-based heterogeneous interconnects, IEEE Transactions on Nanotechnology, vol. 13, no. 3, pp. 488-495, May 2014

Wen-Sheng Zhao, Gaofeng Wang, Lingling Sun, Wen-Yan Yin, and Yong-Xin Guo, Repeater insertion for carbon nanotube interconnects, Micro & Nano Letters, vol. 9, no. 5, pp. 337-339, May 2014

Wen-Sheng Zhao and Wen-Yan Yin, Comparative study on multilayer graphene nanoribbon (MLGNR) interconnects, IEEE Transactions on Electromagnetic Compatibility, vol. 56, no. 3, pp. 638-645, June 2014

Wen-Sheng Zhao, Da-Wei Wang, Gaofeng Wang, and Wen-Yan Yin, Electrical modeling of on-chip Cu-graphene heterogeneous interconnects, IEEE Electron Device Letters, vol. 36, no. 1, pp. 74-76, January 2015

Xu-Chen Wang, Wen-Sheng Zhao*, Jun Hu, and Wen-Yan Yin*, Reconfigurable terahertz leaky-wave antenna using graphene-based high-impedance surface, IEEE Transactions on Nanotechnology, vol. 14, no. 1, pp. 62-69, January 2015

R. Zhang, W.S. Zhao*, W.Y. Yin, Z.G. Zhao, and H.J. Zhou, Impacts of diamond heat spreader on the thermo-mechanical characteristics of high-power AlGaN/GaN HEMTs, Diamond & Related Materials, vol. 52, pp. 25-31, 2015

Rui Zhang, Wen-Sheng Zhao, Jun Hu, and Wen-Yan Yin, Electrothermal characterization of multilevel Cu-graphene heterogeneous interconnects in the presence of an electrostatic discharge (ESD), IEEE Transactions on Nanotechnology, vol. 14, no. 2, pp. 205-209, March 2015

Da-Wei Wang, Wen-Sheng Zhao*, Xiao-Qiang Gu, Wenchao Chen, and Wen-Yan Yin*, Wideband modeling of graphene-based structures at different temperatures using hybrid FDTD method, IEEE Transactions on Nanotechnology, vol. 14, no. 2, pp. 250-258, March 2015

Wen-Sheng Zhao, Gaofeng Wang, Jun Hu, Lingling Sun, and Hui Hong, Performance and stability analysis of monolayer single-walled carbon nanotube interconnects, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 28, no. 4, pp. 456-464, July/August 2015

Wen-Sheng Zhao, Rui Zhang, Yuan Fang, Wen-Yan Yin, Gaofeng Wang, and Kai Kang, High-frequency modeling of Cu-graphene heterogeneous interconnects, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 29, no. 2, pp. 157-165, March/April 2016

Wen-Sheng Zhao, Jie Zheng, Feng Liang, Kuiwen Xu, Xi Chen, and Gaofeng Wang, Wideband modeling and characterization of differential through-silicon vias for 3-D ICs, IEEE Transactions on Electron Devices, vol. 63, no. 3, pp. 1168-1175, March 2016

Wenchao Chen, Wen-Yan Yin, Wen-Sheng Zhao, Ran Hao, Erping Li, Kai Kang, and Jing Guo, Scaling analysis of high gain monolayer MoS2 photodetector for its performance optimization, IEEE Transactions on Electron Devices, vol. 63, no. 4, pp. 1608-1614, April 2016

Na Li, Junfa Mao, Wen-Sheng Zhao, Min Tang, Wenchao Chen, and Wen-Yan Yin, Electrothermal cosimulation of 3-D carbon-based heterogeneous interconnects, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no, 4, pp. 518-526, April 2016

Wen-Sheng Zhao, Jie Zheng, Yue Hu, Shilei Sun, Gaofeng Wang, Linxi Dong, Liyang Yu, Lingling Sun, and Wen-Yan Yin, High-frequency analysis of Cu-carbon nanotube composite through-silicon vias, IEEE Transactions on Nanotechnology, vol. 15, no. 3, pp. 506-511, May 2016

Jing Wang, Mengqiu Long, Wen-Sheng Zhao, Yue Hu, Gaofeng Wang, and K S Chan, A valley and spin filter based on gapped graphene, Journal of Physics: Condensed Matter, vol. 28, no. 28, p. 285302, 2016

Wen-Sheng Zhao, Jie Zheng, Linxi Dong, Feng Liang, Yue Hu, Luwen Wang, Gaofeng Wang, and Qifa Zhou, High-frequency modeling of on-chip coupled carbon nanotube interconnects for millimeter-wave applications, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 8, pp. 1226-1232, August 2016

Linxi Dong, Jiaping Tao, Jinyan Bao, Wen-Sheng Zhao, and Gaofeng Wang, Anchor loss variation in MEMS wine-glass mode disk resonators due to fluctuating fabrication process, IEEE Sensors Journal, vol. 16, no. 18, pp. 6846-6856, September 2016

Aobo Chen, Feng Liang, Bing-Zhong Wang, Wen-Sheng Zhao, and Gaofeng Wang, Conduction mode analysis and impedance extraction of shielded pair transmission lines, IEEE Microwave and Wireless Components Letters, vol. 26, no. 9, pp. 654-656, September 2016

Fei Wen, Xiaoyang Liu, Zhuo Xu, Hua Tang, Wangfeng Bai, Wen-Sheng Zhao, Peng Zheng, Luwen Wang, and Gaofeng Wang, Low loss and high permittivity composites based on poly(vinylidene fluoride-chlorotrifluoroethylene) and lead lanthanum zirconate titanate, Ceramics International, vol. 43, no. 1, part B, pp. 1504-1508, January 2017

Wen-Sheng Zhao, Jie Zheng, Shichang Chen, Xiang Wang, and Gaofeng Wang, Transient analysis of through-silicon vias in floating silicon substrate, IEEE Transactions on Electromagnetic Compatibility, vol. 59, no. 1, pp. 207-216, February 2017

Alessandro Giuseppe D'Aloia, Wen-Sheng Zhao, Gaofeng Wang, and Wen-Yan Yin, Near-field radiated from carbon nanotube and graphene-based nanointerconnects, IEEE Transactions on Electromagnetic Compatibility, vol. 59, no. 2, pp. 646-653, April 2017

Jing Wang, Haorui Lu, Yue Hu, Wen-Sheng Zhao, Gaofeng Wang, and K S Chan, Quantum pumping of layer pseudospin current in biased bilayer graphene, Journal of Physics D: Applied Physics, vol. 50, no. 20, p. 205101, April 2017

Wen-Sheng Zhao, Jie Zheng, Jing Wang, Feng Liang, Fei Wen, Linxi Dong, Dingwen Wang, and Gaofeng Wang, Modeling and characterization of coaxial through-silicon via with electrical floating inner silicon, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 6, pp. 936-943, June 2017

Kuiwen Xu, Fei Liu, Liang Peng, Wen-Sheng Zhao, Lixin Run, and Gaofeng Wang, Multimode and wideband printed loop antenna based on degraded split-ring resonators, IEEE Access, vol. 5, pp. 15561-15570, August 2017

Yue Hu, Yanfei Gong, Huazhen Liu, Qianqian Xu, Wen-Sheng Zhao, Jing Wang, Ying Wang, and Gaofeng Wang, Numerical investigation of high-voltage partial buried P/N-layer SOI LDMOS, IEEE Transactions on Electron Devices, vol. 64, no. 9, pp. 3725-3733, September 2017

Qi-Lin Gu, Peng Zhang, Yi Ru, Hao Song, Wen-Sheng Zhao, and Wen-Yan Yin, A comparative study on electrothermal characteristics of nanoscale multiple gate MOSFETs, Microelectronics Reliability, vol. 78, pp. 362-369, November 2017

Zi-Han Cheng, Wen-Sheng Zhao*, Linxi Dong, Jing Wang, Peng Zhao, Haijun Gao, and Gaofeng Wang*, Investigation of copper-carbon nanotube composites as global VLSI interconnects, IEEE Transactions on Nanotechnology, vol. 16, no. 6, pp. 891-900, November 2017

Da-Wei Wang, Wen-Sheng Zhao, Hao Xie, Jun Hu, Liang Zhou, Wenchao Chen, Pingqi Gao, Jichun Ye, Yang Xu, Hong-Sheng Chen, Er-Ping Li, and Wen-Yan Yin, Tunable THz multiband frequency-selective surface based on hybrid metal-graphene structures, IEEE Transactions on Nanotechnology, vol. 16, no. 6, pp. 1132-1137, November 2017

王高峰,赵文生,孙玲玲,碳基无源器件研究进展综述,电子学报,45(12): 3037-3045, 2017年12月

Haonan Wang, Linxi Dong, Wei Wei, Wen-Sheng Zhao, Kuiwen Xu, and Gaofeng Wang, The WSN monitoring system for large outdoor advertising boards based on ZigBee and MEMS sensor, IEEE Sensors Journal, vol. 18, no. 3, pp. 1314-1323, February 2018

Peng-Wei Liu, Zi-Han Cheng*, Wen-Sheng Zhao, Qijun Lu, Zhangming Zhu, and Gaofeng Wang, Repeater insertion for multi-walled carbon nanotube interconnects, Applied Sciences, vol. 8, no. 2, p. 236, February 2018

Peng Zhao, Yihang Zhang, Rongrong Sun, Wen-Sheng Zhao, Yue Hu, and Gaofeng Wang, Design of a novel miniaturized frequency selective surface based on 2.5-dimensional Jerusalem cross for 5G applications, Wireless Communications and Mobile Computing, vol. 2018, p. 3485208, April 2018

Xiang Fang, Linxi Dong, Wen-Sheng Zhao, Haixia Yan, Kwok Siong Teh, and Gaofeng Wang, Vibration-induced errors in MEMS tuning fork gyroscopes with imbalance, Sensors, vol. 18, no. 6, p. 1755, May 2018

Jing Jin, Wen-Sheng Zhao, Da-Wei Wang, Hong-Sheng Chen, Er-Ping Li, and Wen-Yan Yin, Investigation of carbon nanotube-based through-silicon vias for PDN applications, IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 3, pp. 738-746, June 2018

Wen-Sheng Zhao, Zi-Han Cheng, Jing Wang, Kai Fu, Da-Wei Wang, Peng Zhao, Gaofeng Wang, and Linxi Dong, Vertical graphene nanoribbon interconnects at the end of the roadmap, IEEE Transactions on Electron Devices, vol. 65, no. 6, pp. 2632-2637, June 2018

Wen-Sheng Zhao, Da-Wei Wang, Alessandro Giuseppe D'Aloia, Wenchao Chen, Gaofeng Wang, Wen-Yan Yin, Recent progress of nano-electromagnetic compatibility (nano-EMC) in emerging carbon nanoelectronics, IEEE Electromagnetic Compatibility Magazine, vol. 7, no. 2, pp. 71-81, July 2018

Jing Jin, Wen-Sheng Zhao*, Da-Wei Wang, Liang Zhou, and Wen-Yan Yin*, Multiphysics characterization of polymer-filled through-silicon vias (PF-TSVs) for three-dimensional integration, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 31, no. 4, p. e2348, July/August 2018

Kai Fu, Wen-Sheng Zhao*, Gaofeng Wang, and Madhavan Swaminathan, Modeling and performance analysis of shielded differential annular through-silicon via (SD-ATSV) for 3-D ICs, IEEE Access, vol. 6, pp. 33238-33250, July 2018

Kai Fu, Wen-Sheng Zhao*, Gaofeng Wang, and Madhavan Swaminathan, A passive equalizer design for shielded differential through-silicon vias in 3-D ICs, IEEE Microwave and Wireless Components Letters, vol. 28, no. 9, pp. 768-770, September 2018

Zi-Han Cheng, Wen-Sheng Zhao*, Da-Wei Wang, Jing Wang, Linxi Dong, Gaofeng Wang, and Wen-Yan Yin, Analysis of Cu-graphene interconnects, IEEE Access, vol. 6, pp. 53499-53508, October 2018

Kai Fu, Wen-Sheng Zhao*, Da-Wei Wang, Gaofeng Wang, Madhavan Swaminathan, and Wen-Yan Yin, A compact passive equalizer design for differential channels in TSV-based 3-D ICs, IEEE Access, vol. 6, pp. 75278-75292, November 2018

Na Li, Junfa Mao, Wen-Sheng Zhao, Min Tang, and Wen-Yan Yin, High-frequency electrothermal characterization of TSV-based power delivery network, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 12, pp. 2171-2179, December 2018

Da-Wei Wang, Wenchao Chen*, Wen-Sheng Zhao*, Guo-Dong Zhu, Kai Kang, Pingqi Gao, Jose E. Schutt-Aine, and Wen-Yan Yin*, Fully coupled electrothermal simulation of large RRAM arrays in the thermal-house, IEEE Access, vol. 7, pp. 3897-3908, January 2019

Wen-Sheng Zhao, Peng-Wei Liu, Huan Yu, Yue Hu, Gaofeng Wang, and Madhavan Swaminathan, Repeater insertion to reduce delay and power dissipation in copper and carbon nanotube-based nanointerconnects, IEEE Access, vol. 7, pp. 13622-13633, February 2019

Da-Wei Wang, Wenchao Chen*, Wen-Sheng Zhao*, Guo-Dong Zhu, Zhen-Guo Zhao, Jose E. Schutt-Aine, and Wen-Yan Yin*, An improved algorithm for drift diffusion transport and its application on large scale parallel simulation of resistive random access memory arrays, IEEE Access, vol. 7, pp. 31273-31285, March 2019

Zi-Han Cheng, Wen-Sheng Zhao*, Da-Wei Wang, Jing Wang, Linxi Dong, and Gaofeng Wang, Modelling and delay analysis of on-chip differential carbon nanotube interconnects, Micro & Nano Letters, vol. 14, no. 5, pp. 505-510, May 2019

Wen-Sheng Zhao, Kai Fu, Da-Wei Wang, Meng Li, Gaofeng Wang, and Wen-Yan Yin, Mini-review: Modeling and performance analysis of nanocarbon interconnects, Applied Science, vol. 9, no. 11, p. 2174, May 2019

Da-Wei Wang, Wen-Sheng Zhao, Rui-Zhen Wang, Wenchao Chen, and Wen-Yan Yin, Terahertz frequency selective surface based on metal-graphene structure with independent frequency tuneability, IET Microwaves, Antennas & Propagation, vol. 13, no. 7, pp. 911-916, July 2019

Kai Fu, Jie Zheng, Wen sheng Zhao*, Yue Hu, and Gaofeng Wang, Analysis of transmission characteristics of copper/carbon nanotube composite through-silicon via interconnects, Chinese Journal of Electronics, vol. 28, no. 5, pp. 920-924, September 2019

Jin-Wei Pan, Kai Fu, Qi Liu, Wen-Sheng Zhao*, Linxi Dong, and Gaofeng Wang, Modelling of crosstalk in differential through silicon vias for three-dimensional integrated circuits, IET Microwaves, Antennas & Propagation, vol. 13, no. 10, pp. 1529-1535, October 2019

Yuan-Yuan Zhang, Wen-Sheng Zhao*, Qi Liu, and Gaofeng Wang, Novel electromagnetic bandgap structure for wideband suppression of simultaneous switching noise, Electronics Letters, vol. 55, no. 23, pp. 1243-1245, November 2019

Qi Liu, Hui Li, Yu-Feng Yu, Wen-Sheng Zhao*, and Shuai Zhang*, A novel finger-controlled passive RFID tag design for human-machine interaction, Sensors, vol. 19, no. 23, p. 5125, November 2019

Yue Hu, Zhifeng Liu, Shichang Chen, Jing Wang, Wen-Sheng Zhao, and Gaofeng Wang, Numerical investigation on L-shaped vertical field plate in high-voltage LDMOS, Results in Physics, vol. 15, p. 102547, December 2019

Da-Wei Wang, Wen-Sheng Zhao*, Wenchao Chen, Guodong Zhu, Hao Xie, Pingqi Gao, and Wen-Yan Yin*, Parallel simulation of fully coupled electrothermal processes in large-scale phase-change memory arrays, IEEE Transactions on Electron Devices, vol. 66, no. 2, pp. 5117-5125, December 2019

Linxi Dong, Zhiyuan Qiao, Haonan Wang, Weihuang Yang, Wensheng Zhao, Kuiwen Xu, Gaofeng Wang, Libo Zhao, and Haixia Yan, The gas leak detection based on a wireless monitoring system, IEEE Transactions on Industrial Informatics, vol. 15, no. 12, pp. 6240-6251, December 2019

Li-Chao Fan, Wen-Sheng Zhao*, Hong-Yi Gan, Li He, Qi Liu, Linxi Dong, and Gaofeng Wang, A high-Q active substrate integrated waveguide based sensor for fully characterizing magneto-dielectric (MD) materials, Sensors and Actuators A: Physical, vol. 301, p. 111778, January 2020

Qi Liu, Yu-Feng Yu, Wen-Sheng Zhao, and Hui Li, Microfluidic temperature sensor based on temperature-dependent dielectric property of liquid, Chinese Physics B, vol. 29, no. 1, p. 010701, January 2020

Hong-Yi Gan, Wen-Sheng Zhao*, Li He, Yufeng Yu, Kuiwen Xu, Fei Wen, Linxi Dong, and Gaofeng Wang, A CSRR-loaded planar sensor for simultaneously measuring permittivity and permeability, IEEE Microwave and Wireless Components Letters, vol. 30, no. 2, pp. 219-221, February 2020

Wen Li, Wen-Sheng Zhao*, Peng-Wei Liu, Jing Wang, and Gaofeng Wang, Optimal repeater insertion for horizontal and vertical graphene nanoribbon interconnects, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 33, no. 2, p. e2696, March/Aprial 2020

Fan Jiang, Wen-Sheng Zhao*, and Jun Zhang*, Mini-review: Recent progress in the development of MoSe2 based chemical sensors and biosensors, Microelectronics Engineering, vol. 225, p. 111279, March 2020

Wen-Sheng Zhao, Hong-Yi Gan, Li He, Qi Liu, Da-Wei Wang, Kuiwen Xu, Shichang Chen, Linxi Dong, and Gaofeng Wang, Microwave planar sensors for fully characterizing magneto-dielectric materials, IEEE Access, vol. 8, pp. 41985-41999, March 2020

Qing-Hao Hu, Wen-Sheng Zhao*, Kai Fu, and Gaofeng Wang, Modeling and characterization of differential multibit carbon-nanotube through-silicon vias, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 2, pp. 534-537, March 2020

Peng-Wei Liu, Wen-Sheng Zhao*, Da-Wei Wang, Jing Wang, Yue Hu, and Gaofeng Wang, Optimal repeater insertion for nano-interconnects in current-mode signalling scheme, Micro & Nano Letters, vol. 15, no. 5, pp. 308-312, May 2020

Hong-Yi Gan, Wen-Sheng Zhao*, Qi Liu, Da-Wei Wang, Linxi Dong, Gaofeng Wang*, and Wen-Yan Yin, Differential microwave microfluidic sensor based on microstrip complementary split-ring resonator (MCSRR) structure, IEEE Sensors Journal, vol. 20, no. 11, pp. 5876-5884, June 2020

Wen-Sheng Zhao, Qing-Hao Hu, Yuan-Yuan Zhang, Da-Wei Wang, Jing Wang, Yue Hu, and Gaofeng Wang, Modeling of carbon nanotube-based differential through-silicon vias in 3-D ICs, IEEE Transactions on Nanotechnology, vol. 19, pp. 492-499, July 2020

Da-Wei Wang, Wen-Sheng Zhao, Wenchao Chen, Hao Xie, and Wen-Yan Yin, Fully coupled electrothermal simulation of resistive random access memory (RRAM) array, Science China - Information Sciences, vol. 63, no. 3, p. 189401, August 2020

Linxi Dong, Zhongren Xu, Weipeng Xu, Haixia Yan, Chaoran Liu, Wen-Sheng Zhao, Gaofeng Wang, and Kwok Siong Teh, A characterization of the performance of gas sensor based on heater in different gas flow rate environment, IEEE Transactions on Industrial Informatics, vol. 16, no. 10, pp. 6281-6290, October 2020

Qi Liu, Wen-Sheng Zhao, and Yufeng Yu, Broadband T-bar fed slot antenna array with stable horizontally polarized omnidirectional radiation, International Journal of RF and Microwave Computer-Aided Engineering, vol. 30, no. 11, pp. e22427, November 2020

Li-Chao Fan, Wen-Sheng Zhao*, Da-Wei Wang, Shichang Chen, and Gaofeng Wang, An ultrahigh sensitivity microwave sensor for microfluidic applications, IEEE Microwave and Wireless Components Letters, vol. 30, no. 12, pp. 1201-1204, December 2020

张鹏,孙晓冬,朱家和,王晶,王大伟,赵文生,集成微系统多物理场耦合数值计算关键技术综述,电子与封装,21(10): 100104,2021

Qing-Hao Hu, Wen-Sheng Zhao*, Kai Fu, Da-Wei Wang, and Gaofeng Wang, On the applicability of two-bit carbon nanotube through-silicon via for power distribution networks in 3-D integrated circuits, IET Circuits, Devices & Systems, vol. 15, no. 1, pp. 20-26, January 2021

Qi Liu, Wen-Sheng Zhao, and Yufeng Yu, RFID-based bidirectional wireless rollover sensor for intelligent wheelchair, Microwave and Optical Technology Letters, vol. 63, no. 2, pp. 504-509, February 2021

Tao Wang, Junlong Zou, Gian Piero Puccioni, Wensheng Zhao, Xiao Lin, Hongsheng Chen, Gaofeng Wang, and Gian Luca Lippi, Methodological investigation into the noise influence on nanolasers' large signal modulation, Optics Express, vol. 29, no. 4, pp. 5081-5097, February 2021

Qing-Hao Hu, Wen-Sheng Zhao*, Kai Fu, Da-Wei Wang, and Gaofeng Wang, Electrical modeling of carbon nanotube-based shielded through-silicon vias for three-dimensional integrated circuits, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 34, no. 3, p. e2842, May/June 2021

Hao Jiang, Xiaokang Qi, Quan Wang, Kuiwen Xu, Shichang Chen, Liang Wu, Fang Zhu, Wen-Sheng Zhao, Linxi Dong, Lixin Ran, and Gaofeng Wang, High-precision dielectric sensor system based on balanced CSRR-SIW resonators, International Journal of RF and Microwave Computer-Aided Engineering, vol. 31, no. 7, p. e22696, July 2021

Hong-Yi Gan, Wen-Sheng Zhao*, Da-Wei Wang, Jing Wang, Qi Liu, and Gaofeng Wang, High-Q active microwave sensor based on microstrip complementary split-ring resonator (MCSRR) structure for dielectric characterization, Applied Computational Electromagnetics Society Journal, vol. 36, no. 7, pp. 922-927, July 2021

Yi-Hao Ma, Liang-Hao Ruan, Jing Wang*, Wen-Sheng Zhao*, Yue Hu, Yuhua Cheng, Da-Wei Wang, and Gaofeng Wang, Spatial selected spin filtering effect in Z-shaped MoS2 nanoribbon, IEEE Access, vol. 9, pp. 106784-106789, August 2021

Peng Zhang, Da-Wei Wang*, Wen-Sheng Zhao*, Jiangtao Su, Bin You, and Jun Liu, Multiphysics analysis and optimal design of compressible micro-interconnect for 2.5D/3D heterogeneous integration, Electronics, vol. 10, no. 18, p. 2240, September 2021

Jia-He Zhu, Da-Wei Wang*, Wen-Sheng Zhao*, Jia-Yun Dai, and Gaofeng Wang, A proposal for vertical MOSFET and electrothermal analysis for monolithic 3-D ICs, Electronics, vol. 10, no. 18, p. 2041, September 2021

Wen-Jing Wu, Wen-Sheng Zhao*, Da-Wei Wang, Bo Yuan, and Gaofeng Wang*, Ultrahigh-sensitivity microwave microfluidic sensors based on modified complementary electric-LC and split-ring resonator structures, IEEE Sensors Journal, vol. 21, no. 17, pp. 18756-18763, September 2021

Bin-Xiao Wang, Wen-Sheng Zhao*, Da-Wei Wang, Wen-Jing Wu, Qi Liu, and Gaofeng Wang, Sensitivity optimization of differential microwave sensors for microfluidic applications, Sensors and Actuators A: Physical, vol. 330, p. 112866, October 2021

Wen-Jing Wu, Wen-Sheng Zhao*, Da-Wei Wang, Bo Yuan, and Gaofeng Wang*, A temperature-compensated differential microstrip sensor for microfluidic applications, IEEE Sensors Journal, vol. 21, no. 21, pp. 24075-24083, November 2021

Da-Wei Wang, Wen-Sheng Zhao*, Zheng-Min Zhang, Qi Liu, Hao Xie, Wenchao Chen, Wen-Yan Yin, and Gaofeng Wang, A hybrid streamline upwind finite volume-finite element method for semiconductor continuity equations, IEEE Transactions on Electron Devices, vol. 68, no. 11, pp. 5421-5429, November 2021

Bin-Xiao Wang, Wen-Sheng Zhao*, Da-Wei Wang, Junchao Wang, Wenjun Li, and Jun Liu, Optimal design of planar microwave microfluidic sensors based on deep reinforcement learning, IEEE Sensors Journal, vol. 21, no. 24, pp. 27441-27449, December 2021

Ji Xu, Ying Sun, Jun Liu, Yi-Ding Wei, Wen-Sheng Zhao, and Da-Wei Wang, Fabrication and high-frequency characterization of low-cost fan-in/out WLP technology with RDL for 2.5D/3D heterogeneous integration, Microelectronics Journal, vol. 119, p. 105332, January 2022

Jing Wang, R. Van Pottelberge, Wen-Sheng Zhao, and Francois M. Peeters, Coulomb impurity on a Dice lattice: Atomic collapse and bound states, Physical Review B, vol. 105, p. 035427, January 2022

Peng-Wei Zhu, Xiang Wang*, Wen-Sheng Zhao*, Jing Wang*, Da-Wei Wang, Fang Hou, and Gaofeng Wang, Design of H-shaped planar displacement microwave sensors with wide dynamic range, Sensors and Actuators A: Physical, vol. 333, p. 113311, January 2022

Yu-Hao Fang, Wen-Sheng Zhao*, Fu-Kang Lin, Da-Wei Wang, Junchao Wang, and Wen-Jing Wu, An AMC-based liquid sensor optimized by particle-ant colony optimization algorithms, IEEE Sensors Journal, vol. 22, no. 3, pp. 2083-2090, February 2022

Wen-Sheng Zhao, Bin-Xiao Wang, Da-Wei Wang, Bin You, Qi Liu, and Gaofeng Wang, Swarm intelligence algorithm-based optimal design of microwave microfluidic sensors, IEEE Transactions on Industrial Electronics, vol. 69, no. 2, pp. 2077-2087, February 2022

Wen-Jing Wu, Bo Yuan*, Wen-Sheng Zhao*, and Gaofeng Wang, On-chip miniaturized bandpass filter using gallium arsenide-based integrated passive device technology, Microwave and Optical Technology Letters, vol. 64, no. 4, pp. 688-693, April 2022

Qi Liu, Shuomin Zhong, Yufeng Yu, Wen-Sheng Zhao, and Gaofeng Wang, Platform-tolerant nested-slot RFID tag antenna based on Jigsaw-shaped metasurface, IEEE Antennas and Wireless Propagation Letters, vol. 21, no. 5, pp. 943-947, May 2022

Wen-Sheng Zhao, Rui Zhang, and Da-Wei Wang, Recent progress in physics-based modeling of electromigration in integrated circuit interconnects, Micromachines, vol. 13, no. 6, p. 883, May 2022

Kun Ren, Pengwen Zhu, Taotao Sun, Junchao Wang, Dawei Wang, Jun Liu, and Wensheng Zhao*, A complementary split-ring resonator (CSRR)-based 2D displacement sensor, Symmetry, vol. 14, no. 6, p. 1116, May 2022

Xin-Qing Lei, Jia-He Zhu, Da-Wei Wang*, and Wen-Sheng Zhao*, Design for ultrahigh-density vertical phase change memory: Proposal and numerical investigation, Electronics, vol. 11, no. 12, p. 1822, June 2022

Hao Xu, Wen-Sheng Zhao*, Da-Wei Wang, and Jun Liu, Compact folded SSPP transmission line and its applications in low-pass filters, IEEE Photonics Technology Letters, vol. 34, no. 11, pp. 591-594, June 2022

Hao Xu, Wen-Sheng Zhao*, Wen-Jing Wu, Da-Wei Wang, Haijun Gao, Yue Hu, and Jun Liu, Miniaturized microwave microfluidic sensor based on quarter-mode 2.5-D spoof plasmons, Sensors and Actuators A: Physical, vol. 342, p. 113621, August 2022

Wen-Jing Wu, Wen-Sheng Zhao*, Da-Wei Wang, Bo Yuan, and Gaofeng Wang*, An active microfluidic sensor based on slow-wave substrate integrated waveguide for measuring complex permittivity of liquids, Sensors and Actuators A: Physical, vol. 344, p. 113699, September 2022

赵文生,方宇浩,王大伟,刘军,微波谐振式传感器研究进展,电子学报,50(10): 2530-2541,2022年10月

Wen-Jing Wu, Wen-Sheng Zhao*, and Gaofeng Wang*, A dielectric sensor based on differential microstrip lines coupled with multiple magnetic-LC resonators, IEEE Sensors Journal, vol. 22, no. 20, pp. 19327-19335, October 2022

Da-Wei Wang, Meng-Jiao Yuan, Jia-Yun Dai, and Wen-Sheng Zhao*, Electrical modeling and characterization of graphene-based on-chip spiral inductors, Micromachines, vol. 13, no. 11, p. 1829, October 2022

Fu-Kang Lin, Da-Wei Wang*, Wen-Sheng Zhao*, Yufeng Yu, and Cheng Qian, An ultrahigh-sensitivity microwave angular displacement sensor with a wide dynamic range, Microwave and Optical Technology Letters, vol. 64, no. 10, pp. 1700-1706, October 2022

Wei Ye, Da-Wei Wang, Jing Wang, Gaofeng Wang, and Wen-Sheng Zhao*, An improved split-ring resonator-based sensor for microfluidic applications, Sensors, vol. 22, no. 21, p. 8534, November 2022

Wen-Jing Wu and Wen-Sheng Zhao*, A quality factor enhanced microwave sensor based on modified split-ring resonator for microfluidic applications, IEEE Sensors Journal, vol. 22, no. 23, pp. 22582-22590, December 2022

Jian-Hong Fu, Wen-Jing Wu, Da-Wei Wang, and Wen-Sheng Zhao*, High-sensitivity microfluidic sensor based on quarter-mode interdigitated spoof plasmons, IEEE Sensors Journal, vol. 22, no. 24, pp. 23888-23895, December 2022

Yi-Hao Ma, Da-Wei Wang*, Yufeng Yu, and Wen-Sheng Zhao*, Design of dual-band frequency-selective surfaces with independent tunability, IEEE Transactions on Antennas and Propagation, vol. 70, no. 12, pp. 12381-12386, December 2022

Wen-Sheng Zhao, Editorial for the special issue on advanced interconnect and packaging, Micromachines, vol. 14, no. 1, p. 171, January 2023

Wen-Jing Wu, Wen-Sheng Zhao*, Da-Wei Wang, Bo Yuan, and Gaofeng Wang*, A dual-mode microstrip sensor for simultaneously extracting complex permittivity and permeability of magnetodielectric samples, Sensors and Actuators A: Physical, vol. 349, p. 11400, January 2023

Zeng-Cai Zhang, Fang Hou, Da-Wei Wang, Jun Liu, and Wen-Sheng Zhao*, PSO-algorithm-assisted design of compact SSPP transmission line, IEEE Microwave and Wireless Technology Letters, vol. 33, no. 3, pp. 247-250, March 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A differential THz/MW sensor for characterizing liquid samples based on CSRs, IEEE Sensors Journal, vol. 23, no. 10, pp. 10429-10436, May 2023

Peng Zhang, Da-Wei Wang, Wen-Sheng Zhao*, Bin You, Jun Liu, Cheng Qian, and Hong-Bo Xu, Intelligent design and tunning method for embedded thermoelectric cooler (TEC) in 3D integrated microsystems, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 6, pp. 788-797, June 2023

Peng Zhang, Da-Wei Wang*, and Wen-Sheng Zhao*, Investigation on embedded microchannel heatsink for 2.5D integrated package, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 6, pp. 838-848, June 2023

Wei Ye, Da-Wei Wang, Jing Wang, Shichang Chen, Gaofeng Wang, and Wen-Sheng Zhao*, An ultrahigh-sensitivity dual-mode microwave sensor for microfluidic applications, IEEE Microwave and Wireless Technology Letters, vol. 33, no. 7, pp. 1082-1084, July 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A differential microwave sensor loaded with magnetic-LC resonators for simultaneous thickness and permittivity measurement of material under test by odd- and even-mode, IEEE Sensors Journal, vol. 23, no. 12, pp. 12808-12816, June 2023

徐魁文,苏江涛,赵文生,李文钧,孙玲玲,强电磁干扰下射频集成微系统防护的挑战与机遇,安全与电磁兼容,2023(4): 9-17,2023年8月

Wen-Jing Wu, Lina Shang, Wen-Sheng Zhao, and Gaofeng Wang, A dual-mode microwave sensor for retrieving permittivity of materials based on multiple complementary rectangular ring resonators, Measurement, vol. 218, p. 113215, August 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A modified MLC-based microwave sensing system for retrieving permittivity of liquid samples, IEEE Sensors Journal, vol. 23, no. 15, pp. 16805-16813, August 2023

Maolin Sun, Haowei Xi, Xiaokang Qi, Kuiwen Xu, Huan Li, Qinyi Lv, Shaoqing Hu, Shichang Chen, Wen-Sheng Zhao, Xungen Li, and Wenjun Li, Reconfigurable transmitarray based on FSS for 2D wide-angle beam steering, Electronics, vol. 12, no. 18, p. 3854, September 2023

Wen-Jing Wu and Wen-Sheng Zhao*, Microwave measurement system for characterizing liquid samples based on a modified HMSIW, IEEE Sensors Journal, vol. 23, no. 19, pp. 22466-22475, October 2023

Jian-Hong Fu, Wen-Jing Wu, Hao Xu, and Wen-Sheng Zhao*, A differential active SLSP-based microwave sensor for liquid characterization, IEEE Sensors Journal, vol. 23, no. 20, pp. 24420-24427, October 2023

Wen-Sheng Zhao, Meng-Jiao Yuan, Xiang Wang, and Da-Wei Wang, Circuit modeling and performance analysis of GNR@SWCNT bundle interconnects, Chinese Journal Electronics, vol. 32, no. 6, pp. 1271-1277, November 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A microwave sensor system based on oscillating technique for characterizing complex permittivity of liquid samples, IEEE Sensors Journal, vol. 23, no. 21, pp. 25958-25970, November 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A microwave sensor based on frequency-locked-loop and multiple complementary split-ring resonators for retrieving complex permittivity of liquid samples, IEEE Sensors Journal, vol. 23, no. 24, pp. 30345-30359, December 2023

Da-Wei Wang, Jia-He Zhu, Yi-Fan Liu, Gaofeng Wang, and Wen-Sheng Zhao*, Modeling and simulation of RRAM with carbon nanotube electrode, IEEE Transactions on Nanotechnology, vol. 23, pp. 1-8, January 2024

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A novel differential microwave sensor based on reflective-mode phase-variation of stepped-impedance transmission lines for extracting permittivity of dielectric materials, IEEE Sensors Journal, vol. 24, no. 3, pp. 2746-2757, February 2024

Qi Qiang Liu, Wen-Sheng Zhao*, Huan Wang, and Naixing Feng*, 3-D domain decomposition method with nonconformal meshes for thermoelastic modeling, IEEE Geoscience and Remote Sensing Letters, vol. 21, p. 7502105, February 2024

Hao Xu, Wen-Jing Wu, Wen-Sheng Zhao*, Wenxuan Tang, and Lingling Sun, Ultrasensitive edible oil sensor based on spiral SLSP combined with stepped structure, IEEE Transactions on Instrumentation and Measurement, vol. 73, p. 6003209, February 2024

Jing Wang, Wen-Sheng Zhao, Yue Hu, R. N. Costa Filho, and Francois M. Peeters, Charged vacancy in graphene: Interplay between Landau levels and atomic collapse resonances, Physical Review B, vol. 109, p. 104103, March 2024

Wen-Bin Gao, Xuan Lin*, Guo-Sheng Li, Hong-Shun Yin, Fei-Long Lv, Peng Zhang, Da-Wei Wang*, Wen-Sheng Qian, Hao Zhang, and Wen-Sheng Zhao*, Modeling and signal integrity analysis of silicon interposer channels based on MTL and KBNN, Microelectronics Journal, vol. 147, p. 106186, April 2024

Yi-Hao Ma, Yu-Bin Chen, Qi-Qiang Liu, and Wen-Sheng Zhao*, Design of absorptive common-mode filters based on coupled stripline λ/4 resonator, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 4, pp. 649-658, April 2024

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A novel microwave sensor based on modified rat-race coupler for extracting real permittivity and concentration of binary aqueous solution, IEEE Sensors Journal, vol. 24, no. 9, pp. 14213-14228, May 2024

Da-Wei Wang and Wen-Sheng Zhao*, Editorial for the special issue on advanced interconnect and packaging, 2nd edition, Micromachines, vol. 15, no. 5, p. 643, May 2024

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A novel microwave sensor system based on feedback-type oscillator and modified coplanar waveguide resonator for retrieving complex permittivity of liquid samples, IEEE Sensors Journal, vol. 24, no. 13, pp. 20571-20586, July 2024

Yi-Fan Deng, Yi-Hao Ma, Da-Wei Wang, Xiang Wang*, Wenjun Li*, and Wen-Sheng Zhao*, An absorptive common-mode suppression filter based on resistor-loaded M-type structure, IEEE Transactions on Circuits and Systems II: Express Brief, vol. 71, no. 7, pp. 3483-3487, July 2024

Yun-Cao Bao, Cheng-Hao Yu*, Wen-Sheng Zhao*, Xiao-Dong Wu, Xin Tan, and Yan Liu, Research of single-event burnout in vertical Ga2O3 FinFET by low carrier lifetime control, Semiconductor Science and Technology, vol. 39, no. 8, p. 085009, July 2024

Yi-Fan Liu, Da-Wei Wang*, Zhe-Kang Dong, Hao Xie, and Wen-Sheng Zhao*, Implementation of multiple-step quantized STDP based on novel memristive synapses, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 32, no. 8, pp. 1369-1379, August 2024

Yufeng Yu, Wen-Jing Wu*, Wen-Sheng Zhao*, and Wensong Wang, Feedback-type RF oscillator and modified magnetic-LC resonator based microwave sensing system for characterizing liquid samples,. IEEE Sensors Journal, vol. 24, no. 17, pp. 27465-27479, September 2024

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A Microwave Sensing System Combination of Interdigital Structure (IDS)-Based Microstrip Line and RF Circuits for Extracting Complex Permittivity of Liquid Samples, Sensors and Actuators: A. Physical, vol. 378, p. 115860, September 2024

Wen-Jing Wu, Lina Shang*, Wen-Sheng Zhao*, and Wensong Wang, Fluidic glucose measurement based on a differential microwave sensing system with combination of multistepped-impedance transmission lines, IEEE Sensors Journal, vol. 24, no. 18, pp. 28805-28817, September 2024

Jian-Hong Fu, Wen-Jing Wu*, Qi Qiang Liu*, and Wen-Sheng Zhao*, Microwave microfluidic sensor based on spoof localized surface plasmons for monitoring lubricating oil quality, IEEE Microwave and Wireless Technology Letters, vol. 34, no. 11, pp. 1305-1308, November 2024

Jia-Hao Pan, Wen-Jing Wu*, Qiqiang Liu, Wen-Sheng Zhao*, Da-Wei Wang, Xiao-Ping Hu, Yue Hu*, Jing Wang, Jun Liu, and Lingling Sun, Deep reinforcement learning based optimization of microwave microfluidic sensor, IEEE Microwave and Wireless Technology Letters, vol. 34, no. 11, pp. 1309-1312, November 2024

Zhang-Zhe Feng, Yi-Hao Ma, Qi-Qiang Liu*, and Wen-Sheng Zhao*, Design of absorptive bandpass filters with general Chebyshev response based on λ/4 microstrip lines, Microwave and Optical Technology Letters, vol. 66, no. 11, p. e70032, November 2024

Yun-Yang Xu, Yi-Hao Ma*, Qi Qiang Liu, Yue Hu, Jing Wang, and Wen-Sheng Zhao*, A miniaturized SISL bandpass filter based on deep hole drilling capacitor, Microwave and Optical Technology Letters, vol. 66, no. 11, p. e70027, November 2024

Cheng-Yi Feng, Peng Zhang*, Da-Wei Wang, Wen-Sheng Zhao*, Jing Wang, and Paul Christodoulides*, Hybrid neural network based multi-objective optimal design of hybrid pin-fin microchannel heatsink for integrated microsystems, International Communications in Heat and Mass Transfer, vol. 159, Part B, p. 108137, December 2024

Hai-Tao Ge, Wang-Zi-Xuan Zhen, Cheng-Hao Yu*, Masayuki Yamamoto*, Wen-Sheng Zhao, Hao-Min Guo, and Xiao-Dong Wu, An improved 4H-SiC trench MOS barrier Schottky diode with current spreading layer and low resistance layer, Microelectronics Journal, vol. 154, p. 106451, December 2024

Jia-Hao Pan, Wen-Jing Wu, Qiqiang Liu, Wen-Sheng Zhao*, Da-Wei Wang, Xiao-Ping Hu, Jun Liu, and Lingling Sun, Ultrahigh sensitivity microwave liquid sensor based on 3D comb-shaped capacitive structures, IEEE Sensors Journal, vol. 24, no. 23, pp. 38970-38978, December 2024

Wen-Jing Wu, Hao Xie*, Wen-Sheng Zhao*, and Wensong Wang, A microwave sensor system based on M-SRRs for assessing the complex permittivity of liquid samples, IEEE Sensors Journal, vol. 24, no. 24, pp. 40827-40838, December 2024

Cheng-Pan Huang, Yi-Hao Ma, Qi-Qiang Liu, Wen-Sheng Zhao*, Xiang Wang, Cheng-Hao Yu, abd Da-Wei Wang , PPO algorithm-assisted design of absorptive common-mode suppression filters, IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 6, pp. 2039-2047, December 2024

Chang-Sheng Mao, Da-Wei Wang, Wen-Sheng Zhao*, and Yue Hu, Pseudo-labeling based semi-supervised learning for signal integrity analysis of high-bandwidth memory (HBM) interposer, IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 6, pp. 2056-2064, December 2024

Cheng-Hao Yu, Hui Yang, Hao-Min Guo, Wen-Sheng Zhao*, Xiao-Dong Wu, Xin Tan, Yan Liu, Yun-Cheng Han, and Lei Ren, Research of single-event burnout in P-NiO/n-Ga2O3 heterojunction diode, IEEE Transactions on Device and Materials Reliability, vol. 24, no. 4, pp. 480-486, December 2024.

Jia-Hao Pan, Da-Wei Wang, Wen-Sheng Zhao*, and Xiaoping Hu, Proximal policy optimization based optimization of microwave planar resonators, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 12, pp. 2339-2347, December 2024

P. Uma Sathyakam, P. S. Mallick, Wen-Sheng Zhao, Vasu Jain, and Anshuman Barpanda, Perspective - Prospects and challenges of Cu-CNT composite interconnects, ECS Journal of Solid State Science and Technology, vol. 13, p. 121003, December 2024

Xiao-Pei Zhou, Da-Wei Wang*, Wen-Sheng Zhao*, Peng Zhang, and Jia-Hao Pan, Modeling of through-silicon capacitor and its applications for the optimization of power distribution network in 3-D integrated circuits, IEEE Transactions on Signal and Power Integrity, vol. 3, pp. 199-211, December 2024

Yidan Zhang, Junchao Wang, Jinkai Chen, Guodong Su, Wen-Sheng Zhao, and Jun Liu, Machine learning-enhanced predictive modeling for arbitrary deterministic lateral displacement design and test, IEEE Transactions on NanoBioscience, vol. 24, no. 1, pp. 46-62, January 2025

Guang Chen, Wen-Jing Wu*, Wen-Sheng Zhao*, Jie Huang, and Wensong Wang, A microwave sensing system based on reflective RF oscillator and high-sensitivity coupled-line sensor for extracting real permittivity of liquid samples, IEEE Sensors Journal, vol. 25, no. 1, pp. 476-488, January 2025

Yue Hu, Tianci Wang, Changmiao Wu, Jing Wang, Yuhua Chen, Wen-sheng Zhao, and Gaofeng Wang, Numerical investigation on buried gatet and drift region with P-type blocks in trench SOI LDMOS, Microelectronics Journal, vol. 156, p. 106540, February 2025

Yi-Hao Ma, Da-Wei Wang, Wen-Sheng Zhao*, Cheng-Pan Huang, Bin You, Jun Liu, and Lingling Sun, A dielectric loss based absorptive common-mode filter using transmission space seperation structure, IEEE Transactions on Microwave Theory and Techniques, vol. 73, no, 2, pp. 1134-1146, February 2025

Wen-Jing Wu, Hao Xie*, Wen-Sheng Zhao*, and Wensong Wang, A parallel multi-stepped impedance transmission lines (PMSITL)-based microwave measurement system for characterizing binary aqueous mixtures, IEEE Sensors Journal, vol. 25, no. 4, pp. 6309-6319, February 2025

Jia-Yi Ju, Qi Qiang Liu, Wen-Sheng Zhao*, Peng Zhang, Jing Wang*, Peng Zhao, Xuan Lin*, and Chen-Yang Yao, Distribution optimization of through-silicon via (TSV) array based on genetic algorithm, IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 15, no. 2, pp. 399-409, February 2025

Yue Hu, Tianci Wang, Changmiao Wu, Jing Wang, Yuhua Chen, Wen-sheng Zhao, and Gaofeng Wang, Three-dimensional design of SOI LDMOS with high-k film trench and L-shaped gate, Microelectronics Journal, vol. 157, p. 106571, March 2025

Zhenxin Zhao, Jun Liu, Wensheng Zhao, and Lihong Zhang, Automated topology synthesis of analog integrated circuits with frequency compensation, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 44, no. 3, pp. 832-844, March 2025

Peng Zhang, Da-Wei Wang, and Wen-Sheng Zhao*, A thermal and power integrtiy co-optimization framework for 2.5-D integrated microsystem, IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 72, no. 3, pp. 1397-1410, March 2025

Lina Shang, Guang Chen*, Wen-Jing Wu*, and Wen-Sheng Zhao*, A differential coupled-line based active microwave sensor system for retrieving real permittivity of binary aqueous solution, IEEE Access, vol. 13, pp. 50188-50200, March 2025 (Invited)

Le-Tian Wang, Da-Wei Wang*, Bo-Wen Zhang, Xiao-Feng Yang, and Wen-Sheng Zhao, Proper orthogonal decomposition and long short-term memory neural network based multiphysics digital twin model for electronic device online condition monitoring, IEEE Transactions on Instrumentation and Measurement, vol. 74, p. 2523113, March 2025

Jun Hu, Wen-Jing Wu*, Wen-Sheng Zhao, and Wensong Wang, An active differential microwave sensor with enhanced anti-interference capability for analyzing complex permittivity of liquid samples, IEEE Sensors Journal, vol. 25, no. 9, pp. 15043-05054, May 2025

Hao Xie, Wen-Jing Wu*, Wen-Sheng Zhao*, and Wensong Wang, A differential microwave sensor based on modified high-sensitivity substrate integrated waveguide (SIW) for detecting glucose concentration in aqueous solution, IEEE Sensors Journal, vol. 25, no. 10, pp. 16998-17010, May 2025

Jing Wang, Xiaotai Wu, Wen-Sheng Zhao, Yuhua Cheng, Yue Hu, and Francois M. Peeters, Atomic collapse in gapped graphene: Lattice and valley effects, Physical Review B, vol. 111, no. 24, p. 245402, June 2025

Cheng-Yi Feng, Lazaros Aresti, Peng Zhang, Da-Wei Wang, Wen-Sheng Zhao*, and Paul Christodoulides*, Smart cooling: Hydrogel-enhanced adaptive jet impingement utilizing through silicon via for integrated microsystems, Applied Thermal Engineering, vol. 268, p. 125895, June 2025

Da-Wei Wang, Qing Zhang, Hang Wan, and Wen-Sheng Zhao*, Finite element approach based numerical framework for device simulator, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2025

Xiang-Ru Li, Peng Zhang, Da-Wei Wang, Jun Liu, Lingling Sun, and Wen-Sheng Zhao, Equalizer optimization method based on local multi-constraint modeling-Bayesian optimization with region partitioning, IEEE Transactions on Circuits and Systems I: Regular Papers, 2025

Wei Qi, Duo Xiao*, Hao Xie*, Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A microwave measurement system based on high-selectivity stepped impedance resonators (SIRs) for testing permittivity of dielectric materials and liquid samples, IEEE Sensors Journal, 2025

Yi-Hao Ma, Cheng-Pan Huang, Da-Wei Wang, Shuai Zhang, and Wen-Sheng Zhao*, Novel single-stage absorptive common-mode filters (A-CMFs) unit with sandwiched matching components, IEEE Transactions on Electromagnetic Compatibility, 2025

Cong-Jian Mai, Chang-Sheng Mao, Jia-Hao Pan, Da-Wei Wang*, Yue Hu*, Xiang Wang, and Wen-Sheng Zhao*, Reinforcement learning-based design of interconnects with reduced far-end crosstalk, IEEE Transactions on Electromagnetic Compatibility, 2025

著作

赵文生,王高峰,尹文言,后摩尔时代集成电路新型互连技术,ISBN: 978-7-03-053418-7,科学出版社,2017年9月

Hengyun Zhang, Faxing Che, Tingyu Lin, and Wensheng ZhaoModeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore, Elsevier, 1st edition, ISBN: 978-0-08-102532-1, September 2019

张恒运,车法星,林挺宇,赵文生,超摩尔时代电子封装建模、分析、设计与测试,化学工业出版社,ISBN: 978-7-12-237952-8,2021年3月

Wen-Sheng Zhao, Ed., Advanced Interconnect and Packaging, MDPI, ISBN: 978-3-0365-6733-4, April 2023


Wen-Sheng Zhao and Wen-Yan Yin, Carbon-based interconnects for RF nanoelectronics, Chapter in Wiley Encyclopedia of Electrical and Electronics Engineering, J. Webster, Ed., ISBN: 978-04-7134-608-1, NJ: John Wiley & Sons, Inc., July 2012

Wen-Yan Yin and Wen-Sheng Zhao, Modeling and characterization of on-chip interconnects, Chapter in Wiley Encyclopedia of Electrical and Electronics Engineering, J. Webster, Ed., ISBN: 978-04-7134-608-1, NJ: John Wiley & Sons, Inc., September 2013

Wen-Yan Yin, Wen-Sheng Zhao, and Wenchao Chen, Electro-thermal modeling of carbon nanotubes-based TSVs, Chapter 9 in Carbon Nanotubes for Interconnects: Process, Design and Applications, A. Todri-Sanial, J. Dijon, A. Maffucci, Ed., ISBN: 978-3-319-29744-6, pp. 247-281, Springer, January 2017

Wen-Sheng Zhao, Repeater insertion for carbon nanotube interconnects, Chapter 3 in Emerging Interconnect Technologies for Integrated Circuits and Flexible Electronics, Y. Agrawal, K. Mummaneni, P. Uma Sathyakam, Ed., iSBN: 978-1032363813, pp. 57-80, Springer, 2023

Wen-Sheng Zhao, Interconnect modeling using graphene nano-ribbon (GNR), Chapter 2 in Nano Interconnect Materials and Models for Next Generation Integrated Circuit Design, S. Bhattacharya, J. Ajayan, F. Avila-Herrera, Ed., ISBN: 978-1003331650, pp. 13-33, CRC Press, 2024

发明专利

  1. 林福康,王彬潇,王大伟,赵文生,一种微波传感器谐振结构联合仿真优化方法及系统ZL202110878769.3,2024年12月

  2. 赵文生,王彬潇,林福康,王大伟,刘琦,王高峰,微波微流体传感器通道数值的联合仿真优化方法及系统,ZL202011321042.7,2024年11月

  3. 方宇浩,赵文生,王大伟,基于电磁表面单元结构的微波传感器的联合仿真优化方法,ZL202110457231.5,2024年6月4日

  4. 徐昊,赵文生,王大伟,刘军,一种折叠式人工表面等离激元微波微流传感器,ZL202111286860.2,2024年3月26日

  5. 方宇浩,赵文生,吴文敬,王大伟,袁博,王高峰,用于微流体的温度补偿微带传感器,ZL202111091675.8,2023年10月17日

  6. 叶威,赵文生,王大伟,王晶,王高峰,基于串联LC谐振的高灵敏度微波微流控差分传感器,ZL202111575826.7,2023年8月1日

  7. 赵文生,叶威,王大伟,王晶,王高峰,基于改进缺陷地结构的高灵敏度微波微流控传感器,ZL202111576931.2,2023年8月1日

  8. 叶威,赵文生,王大伟,王晶,王高峰,基于负载开口谐振环的高灵敏度微波微流控传感器,ZL202111575898.1,2023年8月1日

  9. 赵文生,叶威,王大伟,王晶,王高峰,基于改进开口谐振环的高灵敏度微波微流控传感器,ZL202111575827.1,2023年8月1日

  10. 范立超,赵文生,刘琦,王大伟,王高峰,基于衬底集成波导超高灵敏度的微波微流控传感器(已转让),ZL202010043900.X,2023年5月2日

  11. 徐昊,赵文生,王大伟,刘军,一种折叠式人工表面等离激元低通滤波器,ZL202111270619.0,2023年4月18日

  12. 林福康,赵文生,王大伟,一种微波谐振式角度传感器,ZL202110447576.2,2023年3月17日

  13. 钱嘉楠,王晶,赵文生,胡月,王高峰,提高沟道长度亚10nm石墨烯TFET性能的方法,2023年

  14. 陈世昌,沈新程,徐魁文,赵鹏,赵文生,王高峰,多模态高效率MMIC功率放大器及其实现方法,ZL202110925055.3,2022年12月2日

  15. 赵文生,朱鹏文,王大伟,王晶,基于耦合微带线的微波位移传感器,ZL202110455636.5,2022年12月2日

  16. 赵文生,朱鹏文,王大伟,王晶,一种实现高动态范围的微波位移传感器,ZL202110455631.2,2022年11月18日

  17. 赵文生,胡庆豪,傅楷,王高峰,一种屏蔽差分多比特硅通孔结构及其制备方法,ZL201811140729.3,2022年9月13日

  18. 赵文生,胡庆豪,傅楷,王高峰,一种差分多比特硅通孔结构及其制备方法,ZL201811139696.0,2022年9月2日

  19. 陈世昌,贺立鹤,赵文生,徐魁文,赵鹏,王高峰,一种双频高效率异相功率放大器的设计方法,ZL202010165982.X,2022年7月29日

  20. 赵文生,范立超,王大伟,陈世昌,王高峰,可重构四分之一模基片集成波导微波微流控传感器,ZL202010044452.5,2022年7月26日

  21. 马祎浩,王大伟,赵文生,一种双频点单独可调FSS,ZL202110447624.8,2022年6月24日

  22. 赵文生,范立超,王大伟,胡月,陈世昌,王高峰,基于Kapton 200HN和微流体的多功能传感器,ZL201911045245.5,2022年5月31日

  23. 赵文生,甘宏祎,王大伟,陈世昌,刘琦,王高峰,基于微带互补开环谐振器结构的有源微波传感器,ZL202011591212.3,2022年5月27日

  24. 赵文生,范立超,王晶,陈世昌,徐魁文,王高峰,同时测量湿度、温度和材料复介电常数的多功能传感器(已转让),ZL201911044408.8,2022年5月3日

  25. 张鹏,王大伟,朱家和,赵文生,王晶,用于半导体连续性方程的流线迎风有限元方法及系统,ZL20210427767.2,2022年4月

  26. 赵文生,范立超,王晶,陈世昌,王高峰,基于KAPTON 500HN的EMSIW湿度传感器,ZL201911044459.0,2022年4月22日

  27. 赵文生,甘宏祎,陈世昌,徐魁文,王高峰,基于T型馈线激励互补开环谐振器的微波微流体传感器,ZL201911184154.X,2022年4月15日

  28. 赵文生,傅楷,王晶,胡月,王高峰,针对差分硅通孔传输通道的无源均衡器及其设计方法,ZL201811240842.9,2022年4月1日

  29. 赵文生,傅楷,徐魁文,董林玺,王高峰,针对屏蔽差分硅通孔的RL无源均衡器结构及其设计方法,ZL201810575644.1,2022年3月22日

  30. 赵文生,傅楷,胡月,王高峰,针对屏蔽差分硅通孔的RC无源均衡器结构及其设计方法,ZL201810575454.X,2022年3月15日

  31. 赵文生,张园园,王大伟,陈世昌,胡月,王高峰,用于测量液体介电常数的高灵敏度微流体传感器(已转让),ZL201911359858.6,2022年2月18日

  32. 赵文生,张园园,王大伟,王晶,王高峰,基于电磁带隙结构的高灵敏度微波微流体传感器,ZL201911364213.1,2022年2月22日

  33. 阮良浩,王晶,赵文生,张海鹏,提高二硫化钼锯齿形条带自旋极化率的异质结结构及方法,ZL201810928184.6,2022年1月

  34. 赵文生,胡庆豪,王晶,胡月,王高峰,便于工艺生产且节省芯片面积的差分硅通孔结构及其工艺,ZL201910734502.X,2021年12月7日

  35. 胡月,刘志凤,赵文生,王高峰,一种具有L形垂直场板的LDMOS晶体管,ZL201810654105.7,2021年10月

  36. 王晶,封路,阮良浩,赵文生,张海鹏,石墨烯条带异质结双栅TFET及其开关特性提升方法,ZL201810647726.2,2021年6月

  37. 赵文生,甘宏祎,徐魁文,王高峰,用于测量磁介质材料介电常数和磁导率的差分微波传感器,ZL201910389158.5,2021年5月25日

  38. 甘宏祎,赵文生,王晶,胡月,王高峰,用于测量磁介质材料介电常数和磁导率的微波传感器,ZL201910389143.9,2021年5月7日

  39. 赵文生,甘宏祎,胡月,王晶,王高峰,用于同步测量磁介质材料介电常数和磁导率的微波传感器,ZL201910389156.6,2021年5月7日

  40. 甘宏祎,赵文生,徐魁文,王高峰,用于测量磁介质材料介电常数和磁导率的微波传感器,ZL201910389157.0,2021年4月20日

  41. 徐魁文,刘洋,赵文生,陈世昌,赵鹏,王高峰,一种用于测量介电常数的微型三层磁耦合微波传感器,ZL201810419931.3,2021年4月

  42. 徐魁文,刘洋,赵文生,陈世昌,赵鹏,王高峰,一种用于测量介电常数的微型双层磁耦合微波传感器,ZL201810419905.0,2021年4月

  43. 徐魁文,刘洋,赵文生,陈世昌,赵鹏,王高峰,一种用于测量介电常数的差分微波传感器,ZL201810420659.0,2021年4月

  44. 张园园,赵文生,王晶,王高峰,一种实现超宽带抑制同步开关噪声的电磁带隙结构,ZL201910469187.2,2020年12月22日

  45. 赵文生,张园园,王高峰,一种用于抑制同步开关噪声的电磁带隙结构(已转让),ZL201910414536.0,2020年12月15日

  46. 赵文生,范立超,甘宏祎,王高峰,同时测量磁介质材料介电常数和磁导率的高Q有源谐振器(已转让),ZL201910414535.6,2020年11月3日

  47. 陈世昌,王伟伟,郭梦楚,赵鹏,徐魁文,赵文生,王高峰,基于惠斯通电桥的小型便携式复介电常数传感系统,ZL201910092724.6,2020年12月

  48. 陈世昌,曾毛宁,郭梦楚,赵鹏,徐魁文,赵文生,王高峰,一种基于干涉电路的高损耗材料介电常数测量方法,ZL201910091869.4,2020年12月

  49. 徐魁文,段江波,徐正,陈世昌,赵文生,赵鹏,王高峰,一种基于地板辐射模式的多频段MIMO终端天线,ZL201810540045.6,2020年9月

  50. 徐魁文,刘洋,赵文生,陈世昌,赵鹏,王高峰,基于SRRS提高环形天线阻抗匹配和扩展频带的方法,ZL201710358569.9,2020年6月

  51. 徐魁文,楚彦青,赵文生,陈世昌,赵鹏,王高峰,一种基于非均匀背景介质的弹性波成像方法,ZL201810906598.9,2020年1月

  52. 赵文生,泮金炜,王高峰,差分硅通孔阵列中的噪声抑制方法及其差分信号传输结构,ZL201810320148.1,2019年10月18日

  53. 赵文生,郑杰,徐魁文,王高峰,一种内部浮硅的同轴硅通孔等效电路模型及参数提取方法,ZL201610685274.8,2019年10月18日

  54. 赵文生,高璇,泮金炜,郑杰,王高峰,一种基于硅通孔的高品质三维电感器及其制备工艺,ZL201610962996.3,2019年10月22日

  55. 徐魁文,刘飞,赵文生,陈世昌,彭亮,王高峰,一种带有扩展地全频带覆盖的手机终端MIMO双天线,ZL201610551241.4,2019年6月

  56. 王耀田,董林玺,王高峰,王路文,汶飞,赵文生,一种带自标定振动台的电容式加速度传感器,ZL201611126012.4,2019年4月

  57. 赵文生,郑杰,陈世昌,王晶,王高峰,一种高品质因数的差分电感器结构及其制作工艺,ZL201610708670.8,2018年12月7日

  58. 赵文生,郑杰,陈世昌,徐魁文,王高峰,一种高品质因数的三维电感器结构及其制作工艺(已转让),ZL201610707516.9,2018年10月2日

  59. 赵文生,郑杰,王高峰,运用多导体硅通孔的螺线管式电感与变压器结构(已转让),ZL201410617853.X,2017年2月22日


实用新型

  1. 赵文生,泮金炜,徐魁文,赵鹏,王高峰,董林玺,运用螺线管式硅通孔电感的无源谐振器,ZL201721542265.X,2018年8月10日

  2. 赵文生,泮金炜,徐魁文,赵鹏,王高峰,运用垂直螺旋式硅通孔电感的低通滤波器,ZL201721541664.4,2018年8月7日

  3. 赵文生,泮金炜,赵鹏,徐魁文,王高峰,运用垂直螺旋式硅通孔电感的新型超紧凑无源谐振器,ZL201721540734.4,2018年8月7日

  4. 高璇,赵文生,泮金炜,郑杰,一种基于硅通孔的高品质三维电感器,ZL201621187433.3,2018年8月4日

  5. 赵文生,傅楷,黄裕磊,徐魁文,王高峰,运用硅通孔结构的新型切皮雪夫滤波器,ZL201721306082.8,2018年7月24日

  6. 赵文生,郑杰,陈世昌,徐魁文,王高峰,一种具有高品质因数的三维电感器结构,ZL201620923695.5,2017年7月21日

  7. 赵文生,郑杰,陈世昌,王晶,王高峰,一种具有高品质因数的差分电感器结构,ZL201620918572.2,2017年4月19日


软件著作权

  1. 一种表征器件效应的耦合微带线建模软件V1.0,2023SR0277489,2022年4月

  2. 一种表征器件效应的非对称耦合微带线建模软件V1.0,2023SR0277487,2022年4月

  3. 一种表征器件效应的微带薄膜电容器建模软件V1.0,2022SR1436020,2022年4月

  4. 一种表征器件效应的微带交趾耦合器建模软件V1.0,2023SR0281306,2022年4月

  5. 一种表征器件效应的微带扇形线建模软件V1.0,2023SR0276773,2022年3月

  6. 一种表征器件效应的同轴线建模软件V1.0,2023SR0276777,2022年3月

  7. 一种表征器件效应的非对称带状线建模软件V1.0,2023SR0277449,2022年3月

  8. 一种表征器件效应的薄膜电容建模软件V1.0,2022SR1453091,2022年2月

  9. 一种表征器件效应的微带线间隙建模软件V1.0,2022SR1435831,2021年12月

  10. 一种表征器件效应的带状线建模软件V1.0,2022SR1436019,2021年12月

  11. 一种表征器件效应的耦合带状线建模软件V1.0,2023SR0277486,2021年12月

  12. 针对铜/碳纳米互连的缓冲器设计软件V1.0,2018SR1004739,2018年8月

指导研究生获得荣誉奖励

2017届:

郑杰获国家奖学金、华为三等奖学金、研究生科研创新基金、浙江省优秀毕业生,在读期间于海康实习8个月并入职,获海康最佳新人奖,现任职于蚂蚁

2018届:

程梓晗获国家奖学金、杭电十佳科创之星、华为三等奖学金、研究生科研创新基金、浙江省优秀毕业生,获成电博士学位,现为成电博后

泮金炜获国家奖学金、浙江省优秀毕业生,就职于海康

2019届:

傅楷获国家奖学金(2次)、浙江省专业学位研究生优秀实践成果(全省100人)、研究生科研创新基金、浙江省优秀毕业生,前往港城读博

刘朋伟获国家奖学金、华为二等奖学金、浙江省优秀毕业生,就职于中兴

2021届:

甘宏祎获国家奖学金、华为一等奖学金、浙江省专业学位研究生优秀实践成果(全省100人)、研究生科研创新基金、浙江省教育厅一般科研项目(研究生专项)

范立超获国家奖学金、浙江省专业学位研究生优秀实践成果(全省100人)

胡庆豪获国家奖学金、浙江省优秀毕业生

2022届:

王彬潇获国家奖学金、华为杯研究生数学建模竞赛三等奖、中青杯大学生数学建模二等奖、浙江省专业学位研究生优秀实践成果(全省100人),就职于华芯巨数EDA公司

2023届:

徐昊获国家奖学金、浙江省优秀毕业生、校优秀硕士学位论文、浙江省专业学位研究生优秀实践成果(全省100人),前往东南大学读博,中国电子学会优秀硕士学位论文激励计划(杭电第二次)

张增才获校优秀硕士学位论文

2024届:

付建红获国家奖学金、浙江省教育厅一般科研项目(研究生专项)、浙江省专业学位研究生优秀实践成果,前往成电读博

蒋奇松获ACES-China 2023会议最佳海报奖

2025届:

尹宏顺、高文斌、吕飞龙、岳芯茹、高明羿获首届全国先进计算技术创新大赛一等奖(奖金5万元),尹宏顺就职于湖北九同方微电子公司,开展射频集成电路EDA工具研发

毛昌盛、潘佳浩、张博文、徐昀扬等人获得研究生科研创新基金,潘佳浩获得国家奖学金,张搏文获第三届全国集成微系统建模与仿真学术交流会优秀论文二等奖、毛昌盛就职于华为海思

张鹏获研究生科研创新基金(2次)、智芯会议学术交流优秀论文

2026届:

叶子兴、李开峰等获得研究生科研创新基金

王乐天、陈临渊、张庆获第七届中国研究生创“芯”大赛行芯专项一等奖、全国决赛三等奖

刘佳欣、岳芯茹、高明羿中国研究生创“芯”大赛·EDA精英挑战赛总决赛(赛题六)一等奖(奖金2万元)、EDA国创中心企业特别奖,叶子兴、万航、尹宏顺中国研究生创“芯”大赛·EDA精英挑战赛总决赛(赛题七)一等奖(奖金2万元)、华大九天企业特别奖(EDA精英挑战赛共设置10道赛题,全国535支队伍参加,其中赛题六/七/十第一名由杭电研究生获得

付青松、李相儒、潘佳浩获中国研究生创“芯”大赛·EDA精英挑战赛总决赛(赛题六)二等奖(奖金8千元)

王乐天、李森森、罗威获中国研究生创“芯”大赛·EDA精英挑战赛总决赛(赛题四)三等奖,麦聪健、虞梦怡、毛昌盛获中国研究生创“芯”大赛·EDA精英挑战赛总决赛(赛题九)三等奖

2028届:

马祎浩获得研究生科研创新基金


* 相关奖励较多,或有遗漏。


个人获得荣誉奖励

2015:Best Student Paper Award, IEEE EDAPS 2015(3/4)

2017:浙江省科协“育才工程”(结题优秀)

2017:浙江省151人才工程第三层次

2020:中国电子学会优秀科技工作者荣誉称号

2020:浙江省高校领军人才青年优秀人才

2020:第三届中青杯全国大学生数学建模竞赛优秀指导老师奖

2020:bob电竞ios 星耀杭电“科研之星”

2021:浙江省高层次人才特支计划青年拔尖人才

2021:bob电竞ios “邱均平颜金莲研究生教育奖励基金”首届杰出导师奖(全校2人)

2022:Outstanding Associate Editor, IEEE Access

2022:Young Scientist Award, IEEE ICET 2022

2023:Best Student Poster Award, ACES-China 2023(4/4)

2023:Top Cited Article (2021-2022) in IET Circuits, Devices & Systems

2023:全国集成微系统建模与仿真学术交流会优秀论文二等奖

2023:bob电竞ios 校级教学成果一等奖:前沿引领、平台支撑、项目驱动——电子科学与技术专业科研育人实践与成效(3/8)

2023:bob电竞ios 校级研究生教学成果一等奖:科研项目牵引、产教研用融合、中外联合培养的集成电路方向研究生培养模式探索与实践(8/8)

2024:美国斯坦福大学全球前2%顶尖科学家年度榜单

2024:中国研究生创“芯”大赛·EDA精英挑战赛优秀指导老师奖

2025:bob电竞ios 校级研究生教学成果二等奖:精准分类、融合贯通、全程引导,培养集成电路EDA方向高质量研究生(1/8)

2025:浙江省研究生教育学会教育成果二等奖:项目牵引、产研融合、中外协同的集成电路专业研究生培养模式创新与实践(6/9)